3M Wafer Support System - Wafer Backgrinding | Wafer
After wafer thinning, the glass substrate continues to provide support for post-grinding processes such as etch, CMP, or metal deposition. Because the temporary wafer bonding process creates support for the entire face and the edges of the wafer, it results in less warpage, cracking, and edge chipping, and helps promote higher yields.
IC Packaging & Assembly Experts - QP Technologies | IC,
Wafer Backgrinding. We perform automated, volume backgrinding of 100mm to 300mm (4 to 12 inches) wafers, as well as partial wafers and individual die, to meet your wafer preparation needs. We also thin and polish such materials as glass, quartz and ceramic. Learn More >
Tapes for Semiconductor Process
surface of semiconductor wafer during backgrinding process, and to hold semiconductor wafer with ring frame during dicing process. It is also applicable for various workpieces such as ceramics, glass, sapphire and so on., for Global Quality Management System about design, development and manufacture of tapes for semiconductor process.
Ultron Systems, Inc. -- Wafer Cleaning Systems | UH117,
The Model UH119 Semiautomatic Wafer Cleaning System is Ultron Systems' latest design in quality wafer cleaning operations. Designed primarily for post-dicing applications, the UH119's non-contact cleaning ability utilizes a variable-cycle, high pressure wash for highly efficient, fast, and exceptional wafer cleaning.
Ipoh - Unisem Group
Unisem Ipoh is Unisem Groups full turnkey assembly and test operations located in Malaysia. Unisem Ipoh offers an integrated suite of packaging and test services for semiconductor companies such as wafer bump, wafer probe, wafer backgrinding, a wide range of leadframe and substrate IC packaging, high-end radio frequency and mix-signal test, tape & reel and
Wafer dicing - edolgona.de
g. Wafer Dicing. Depending upon the wafer structure, cost, throughput and end quality requirement; one can choose appropriate wafer singulaiton method that meets quality and yield requirement. The dicing tapes are based on PVC, PO or PT plastics. Major Distinguishing Characteristics: 1. Precision Wafer Dicing and Wafer Backgrinding.
Home - Unisem Group
Unisem is a global provider of semiconductor assembly and test services; offering an integrated suite of services such as wafer bumping, wafer probing, wafer grinding, IC packaging, and high-end RF and mixed-signal test services.
Home [www.tf-amd.my]
TF-AMD use fully-automated wafer back grinding equipment to achieve high level of quality for post grind wafer. The process includes wafer backgrinding, die singulation, AOI and packing in tape & Reel. WLCSP are shipped in a Tape and Reel carrier or waffle pack to hand various customer die sorting requirements.
Lintec of America, Inc – Lintec USA
Quality and Support you can count on LINTEC's semiconductor manufacturing related products include a wide array of lines. Our Adwill product consists of high-functioning adhesive tapes such as Non UV and UV dicing tape, wafer surface protective tape for BG process, backside laminate tape and die attach specialty films.
Eight Major Steps to Semiconductor Fabrication, Part 8,
Jun 10, 2015· 4. Tape Laminate & Backgrinding . The tape laminate and backgrinding processes are required when assembling very thin products, such as IC cards that are used in transit cards or passports. The back side of the wafer is ground using a grinding wheel made up of fine diamond particles. This process files down the wafer, facilitating chip assembly.
Kezuru - DISCO
High quality DAF separation Increase in die yield per wafer High grade DAF separation in combination with the Die Separator Stealth dicing does not require space on the wafer to be allocated for cutting as the kerf width is almost 0. As a result, street width can be greatly reduced and the number of die obtainable per wafer can be increased.
Technology - GlobalWafers
Wafer backside after backgrinding and caustic etching. Fracture analysis revealed that the origin of the breakage was at this row of caustic etched grooves. The backgrinding process created rows of extra deep cracks in the wafer backside. Caustic etching produced the grooves by etching away part of the crack damage.
Optical Polishing Lapping Dicing Services, Flat Components,
Optical polishing services, CMP polishing, optical waveguide edge and optical angle polishing, wafer dicing and substrate dicing services, back grinding, flat lapping and CNC machining of all hard materials including Ceramic substrates, Quartz, Aluminum Nitride (AlN), Optical Glass, Sapphire windows, Silicon wafers and very thin lapped glass or optically polished substrates
Loadpoint Home - High precision dicing and micro
Loadpoint develop, manufacture and supply high precision dicing machines and machining systems for Semiconductors, Photonics, MEMs, PZT & Piezo materials, specialist materials and related industries. As pioneers in their field they can
DISCO Corporation Product and technology information
Introduction to wheel coolant additives that can improve processing quality and related products (various cassettes, frames, etc.) necessary for using precision processing equipment., Process that improves handling for thin wafers without using secondary materials by leaving the edge and only backgrinding the inner section of the wafer. See,
Back-illuminated sensor - Wikipedia
A back-illuminated sensor, also known as backside illumination (BSI or BI) sensor, is a type of digital image sensor that uses a novel arrangement of the imaging elements to increase the amount of light captured and thereby improve low-light performance.. The technique was used for some time in specialized roles like low-light security cameras and astronomy sensors, but was
Microelectromechanical systems - Wikipedia
Microelectromechanical systems (MEMS), also written as micro-electro-mechanical systems (or microelectronic and microelectromechanical systems) and the related micromechatronics and microsystems constitute the technology of microscopic devices, particularly those with moving parts. They merge at the nanoscale into nanoelectromechanical systems (NEMS) and
EUROPRACTICE | Schedules 2021
STMicroelectronics Wafer Level Bumping. on 300mm ST 55nm BiCMOS055 process. 25,000 8. 1,500 8. on 300mm ST 65nm CMOS065. 23,000 8. 1,500 8. on 300mm ST 28nm CMOS28FDSOI. 33,000 8. 1,500 8. Important notes: 1 Area = X*Y including seal ring. 2 Price for Area ≤ 2mm 2 with minimum charge of 1.25mm 2.
Confidential for truly Only - SparkFun Electronics
backgrinding, reconstructed wafer) 00applications cellular phones toys PC multimedia digital still cameras 00features 1.4 µm x 1.4 µm pixel with OmniBSI technology for high performance (high sensitivity, low crosstalk, low noise) optical size of 1/4" automatic image control functions: automatic exposure control (AEC), automatic white balance
Kezuru - DISCO
High quality DAF separation Increase in die yield per wafer High grade DAF separation in combination with the Die Separator Stealth dicing does not require space on the wafer to be allocated for cutting as the kerf width is almost 0. As a result, street width can be greatly reduced and the number of die obtainable per wafer can be increased.
Technology - GlobalWafers
Wafer backside after backgrinding and caustic etching. Fracture analysis revealed that the origin of the breakage was at this row of caustic etched grooves. The backgrinding process created rows of extra deep cracks in the wafer backside. Caustic etching produced the grooves by etching away part of the crack damage.
Optical Polishing Lapping Dicing Services, Flat Components,
Optical polishing services, CMP polishing, optical waveguide edge and optical angle polishing, wafer dicing and substrate dicing services, back grinding, flat lapping and CNC machining of all hard materials including Ceramic substrates, Quartz, Aluminum Nitride (AlN), Optical Glass, Sapphire windows, Silicon wafers and very thin lapped glass or optically polished substrates
Loadpoint Home - High precision dicing and micro
Loadpoint develop, manufacture and supply high precision dicing machines and machining systems for Semiconductors, Photonics, MEMs, PZT & Piezo materials, specialist materials and related industries. As pioneers in their field they can
DISCO Corporation Product and technology information
Introduction to wheel coolant additives that can improve processing quality and related products (various cassettes, frames, etc.) necessary for using precision processing equipment., Process that improves handling for thin wafers without using secondary materials by leaving the edge and only backgrinding the inner section of the wafer. See,
Back-illuminated sensor - Wikipedia
A back-illuminated sensor, also known as backside illumination (BSI or BI) sensor, is a type of digital image sensor that uses a novel arrangement of the imaging elements to increase the amount of light captured and thereby improve low-light performance.. The technique was used for some time in specialized roles like low-light security cameras and astronomy sensors, but was
Microelectromechanical systems - Wikipedia
Microelectromechanical systems (MEMS), also written as micro-electro-mechanical systems (or microelectronic and microelectromechanical systems) and the related micromechatronics and microsystems constitute the technology of microscopic devices, particularly those with moving parts. They merge at the nanoscale into nanoelectromechanical systems (NEMS) and
EUROPRACTICE | Schedules 2021
STMicroelectronics Wafer Level Bumping. on 300mm ST 55nm BiCMOS055 process. 25,000 8. 1,500 8. on 300mm ST 65nm CMOS065. 23,000 8. 1,500 8. on 300mm ST 28nm CMOS28FDSOI. 33,000 8. 1,500 8. Important notes: 1 Area = X*Y including seal ring. 2 Price for Area ≤ 2mm 2 with minimum charge of 1.25mm 2.
Confidential for truly Only - SparkFun Electronics
backgrinding, reconstructed wafer) 00applications cellular phones toys PC multimedia digital still cameras 00features 1.4 µm x 1.4 µm pixel with OmniBSI technology for high performance (high sensitivity, low crosstalk, low noise) optical size of 1/4" automatic image control functions: automatic exposure control (AEC), automatic white balance
